Seamless, Secure, Scalable:
Your Digital Landscape Refined Building Tomorrow's Infrastructure Today

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ACHIEVEMENTS

Recent Achievements

RISC V processor coresDelivered validated designs of various types of RISC-V processor cores including CVA6 and PULP with SPE verification for vector operations and FPU pipeline verification
RISC-V ISA verificationCustom ISA verification for vector operations utilizing Google riscv-test and riscv-tourture using SPIKE model on CVA6 RISC-V processor architecture
Memory Subsystem modelsDelivered validated designs of various types of RISC-V processor cores including CVA6 and PULP with SPE verification for vector operations and FPU pipeline verification
Digital communicationDeveloped multiple digital communication port protocol hardware designs including AXI (AXI4, AXI4Stream, AXI4lite), APB, Ethernet, and serial (USB, I2C, SPI, UART)
Advanced Bus bridgesDesign and verification of bus bridges, adapters, and converters for AXI4-to-APB, AXI4stream-to-AXI4, AXI-Xbar, SerDes, etc.
Expertise in diverse DV
  • 01

    SV for hardware design and linear verification

  • 02

    UVM test architecture for VIP and complex hardware verification

  • 03

    SystemC verification for complete system model simulation

  • 04

    Integration and automation with scripting languages such as C++, Python, and bash makefile scripts

  • 05

    RISC ISA verification on CVA6 processors using SPIKE model

  • 06

    RISC-V assembly and machine code simulation and validation for functionality

  • 07

    SV, Verilog, and VHDL support for FPGA programming

  • 08

    C, C++, and python support for microcontrollers such as ESP32 with freeRTOS

  • 09

    Tailored and AI-driven backend testing and verification for layout, PnR, and physical testing

Rigorous Design and Verification
Pushing the boundaries of innovation in semiconductor design and validation.
  • Enhanced Performance Acceleration
  • Tailored Customization Solutions
  • Streamlined Data Control Efficiency
  • Synergistic Collaborative Excellence
  • Design Optimization for Peak Efficiency
High-Precision Physical Design
Crafting precise, performance-optimized physical layouts
  • Technology Node Assessment and Library Evaluation
  • High-Efficiency Synthesis Strategies
  • Strategic DFT Insertion and Optimization
  • Rigorous Formal Verification Methods
  • Optimized Placement and Routing
  • Comprehensive Physical Verification Protocols
  • Precision Timing Closure Practices
  • Thorough Power and IR Analysis
  • Post-Silicon Metal-Only ECO Management
Advanced Firmware Solutions
Elevating firmware solutions to meet the demands of the future
  • Innovative Embedded Application Development
  • Advanced Transaction-Level Modeling (TLM) Expertise
  • Efficient RTL Software Simulation
  • Robust Testing and Automation Solutions
  • Mastery in Testing Frameworks
Next-Gen IC Package Design
Shaping the future of IC packaging with innovation and precision
  • Silicon Initiation Assistance for expert guidance and support.
  • Package Feasibility in assessing size, cost, and materials.
  • Package Design with tailored solutions.
  • Package Release to ensure a seamless transition.
  • Engineering Build for meticulous construction.
  • Verification through rigorous testing and analysis.
  • Production of excellence from prototype to mass production.
Infrastructure
In-house expertise for setup and maintenance of secured Amazon AWS infrastructure to serve clients
  • State-of-the-art cloud security
  • Highly scalable
  • Cost effective
  • Cross platform syncing
TOOLS

Tools We Use

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Industries Served
  • General Computing

  • Automotive

  • Telecommunications

  • IoT

  • Artificial Intelligence

Development Partner
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BLOG

Latest words and thoughts

The Road to RISC-V SoC Design: My Professional Evolution

The Road to RISC-V SoC Design: My Professional Evolution

Foez Ahmed, Hardware Verification Engineer
A Designer’s Odyssey in RISC-V Processor Development

A Designer’s Odyssey in RISC-V Processor Development

Foez Ahmed, Hardware Verification Engineer.
Chiplet Packaging: 2.5D

Chiplet Packaging: 2.5D

Robiat Rafi, IC Package Design Engineer

USA Office

8201 164th Ave NE, Suite 200

Redmond WA 98052

United States of America

+1 (404) 287-0730

Bangladesh Office

House 177, Lane 2, New DOHS

Mohakhali, Dhaka 1206

Bangladesh

+88 02222287041

+88017300-374-00

European Liaison Office

32 Swansea Court

London

E16 2RT

United Kingdom

+44 7850 051037

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