Your one stop RTL-to-GDSII solution!

Your complete RTL-to-GDSII solution, delivering efficiency and expertise at every step of the process. Trust us to bring your semiconductor designs to life seamlessly and successfully.

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Integrate
We seamlessly integrate with your team.
With a firm belief that great collaboration leads to the creation of exceptional products
Turn-Key Solution
Turn-key design solutions for you.
Our in-house PD flow and exhaustive checklist takes care of GDS quality for manufacturing and signoff/PPA requirement
PDK & Library Evaluation
  • PPA analysis for multiple frequencies, technology node, standard cell libraries to pick the most suitable node and constraints
Synthesis
  • Physical-aware
  • CPF/UPF
  • 3rd Party IP integration
DFT Insertion
  • ATPG and Coverage Analysis
  • ATPG Simulation
Formal Verification
  • RTL to gate-level and gate-level to post-layout LEC to ensure functional integrity
Place and Route
  • LEF/DEF Flow
    • Digital Top
    • Integration of Analog blocks
  • EDI-OA Interoperability
    • Mixed-Signal, Analog-on-top
Physical Verification
  • LVS
  • DRC
  • ERC
  • DFM
Timing Closure
  • Parasitic Extraction
  • Static Timing Analysis
  • MMMC
  • Timing ECO
  • DSTA, DMMMC
  • IR-Aware
Power/IR Analysis
  • Balance power consumption and speed
Post-Silicon Metal-Only ECO
  • Smart Spare distribution in early stage to accommodate post-silicon changes in limited layers

Read what we wrote

Get front-row industry insights

The Road to RISC-V SoC Design: My Professional Evolution

The Road to RISC-V SoC Design: My Professional Evolution

Foez Ahmed, Hardware Verification Engineer
A Designer’s Odyssey in RISC-V Processor Development

A Designer’s Odyssey in RISC-V Processor Development

Foez Ahmed, Hardware Verification Engineer.
Chiplet Packaging: 2.5D

Chiplet Packaging: 2.5D

Robiat Rafi, IC Package Design Engineer

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+44 7850 051037

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