Your one stop RTL-to-GDSII solution!
Your complete RTL-to-GDSII solution, delivering efficiency and expertise at every step of the process. Trust us to bring your semiconductor designs to life seamlessly and successfully.

We seamlessly integrate with your team.
With a firm belief that great collaboration leads to the creation of exceptional products
Turn-key design solutions for you.
Our in-house PD flow and exhaustive checklist takes care of GDS quality for manufacturing and signoff/PPA requirement
PDK & Library Evaluation
- PPA analysis for multiple frequencies, technology node, standard cell libraries to pick the most suitable node and constraints

Synthesis
- Physical-aware
- CPF/UPF
- 3rd Party IP integration

DFT Insertion
- ATPG and Coverage Analysis
- ATPG Simulation

Formal Verification
- RTL to gate-level and gate-level to post-layout LEC to ensure functional integrity

Place and Route
- LEF/DEF Flow
- Digital Top
- Integration of Analog blocks
- EDI-OA Interoperability
- Mixed-Signal, Analog-on-top

Physical Verification
- LVS
- DRC
- ERC
- DFM

Timing Closure
- Parasitic Extraction
- Static Timing Analysis
- MMMC
- Timing ECO
- DSTA, DMMMC
- IR-Aware

Power/IR Analysis
- Balance power consumption and speed

Post-Silicon Metal-Only ECO
- Smart Spare distribution in early stage to accommodate post-silicon changes in limited layers

Read what we wrote
Get front-row industry insights
The Road to RISC-V SoC Design: My Professional Evolution
Foez Ahmed, Hardware Verification Engineer
A Designer’s Odyssey in RISC-V Processor Development
Foez Ahmed, Hardware Verification Engineer.
Chiplet Packaging: 2.5D
Robiat Rafi, IC Package Design Engineer
USA Office
8201 164th Ave NE, Suite 200
Redmond WA 98052
United States of America
+1 (404) 287-0730
Bangladesh Office
House 177, Lane 2, New DOHS
Mohakhali, Dhaka 1206
Bangladesh
+88 02222287041
+88017300-374-00
European Liaison Office
32 Swansea Court
London
E16 2RT
United Kingdom
+44 7850 051037